Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators

Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques Aligns the Lightwave Technology Platform with Mainstream Silicon Electronics Chip-Scale Packaging, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging ENGLEWOOD, Colo. , June 23, 2022…